TEST SYSTEMS

nanome|x 180 + CT

nanome|x 180 + CT – The high-end X-ray system for 2D-and 3D analysis (computed tomography)

nanome|x 180

High-resolution X-ray system for the inspection of high-quality structure-and connection technology

The Test system

nanome|x 180 + CT

Technical data and configuration

X-ray tube: micro- / nanofocus transmission tube (open)

Tube voltage: 180 kV
Max. Tube power: 20 W
Target: Diamond window

X-ray detector: 2 MPixel image intensifier (BV) + digital detector GE DXR250RT

temperature stabilized with active cooling
Pixel: 1000 x 1000
Resolution: 200 x 200 µm
Frame rate: up to 30 fps in full screen mode

Manipulator: High-precision synchronized vibration-free 5-axis manipulation

Max. Transmitted light area: 460 mm x 360 mm
Max. Specimen size/weight: 680 mm x 635mm / 10 kg
Oblique transmission: continuously adjustable. Projection angle up to 70°, rotation 0°-360°
Rotation and tilt unit: tilt +/- 45°, rotation n 360°, up to 2 kg
CT unit: precision rotation axis

System enlargement:

Geometric magnification (DXR detector): 1,970x
Total magnification (DXR detector): max. 2,660x

System resolution:

Detail detectability down to 0.2 µm (in 2D mode)

3D mode (CT):

Max. Max. geometric magnification: 100x
Max. Voxel resolution: up to 2 µm, depending on sample size
Volume acquisition and reconstruction software: phoenix datos|x

Software modules:

bga|module for automatic BGA solder joint control
vc|module for automatic pore evaluation

The test systems

The Test system

nanome|x 180

Technical data and configuration

X-ray tube: micro- / nanofocus transmission tube (open)

Tube voltage: 180 kV
Max. Tube power: 15 W
Target: Tungsten

X-ray detector:

Digital image chain with high resolution 4″ dual-field image intensifier
2MPixel digital camera and 24″ TFT display

Manipulator: High-precision synchronized vibration-free 5-axis manipulation

Max. Transmitted light area: 460 mm x 360 mm
Max. Specimen size/weight: 680 mm x 635mm / 10 kg
Oblique transmission: continuously adjustable. Projection angle up to 70°, rotation 0°-360°
Rotation and tilt unit: tilt +/- 45°, rotation n 360°, up to 2 kg

System enlargement :

Geometric magnification up to 1,630x
Total magnification up to 17,490x

System resolution:

Detail detectability down to 0.2 µm (200nm)

3D mode (CT):

CT Preparation for future CT upgrade

Software modules:

bga|module for automatic BGA solder joint control
vc|module for automatic pore evaluation

The test systems

We are looking forward to your inquiry!